EP3SL200F1152I4N FPGA: Specifications, Features, and Applications | Intel Stratix III
EP3SL200F1152I4N FPGA: In-Depth Technical Guide for Engineers
The EP3SL200F1152I4N from Intel's Stratix III family represents a pinnacle of FPGA technology, offering unparalleled flexibility for complex digital designs. Despite its obsolete status, this 1152-FBGA packaged device continues to power critical systems across industries due to its exceptional balance of performance, I/O capability, and on-chip memory.
Detailed Technical Specifications
Architectural Overview
Built on Intel's advanced 65nm process technology, the EP3SL200F1152I4N delivers:
- 200,000 programmable logic elements organized in 8,000 LABs (Logic Array Blocks)
- 10.9 million bits of embedded RAM for high-speed data buffering
- 744 user I/O pins with programmable slew rate and drive strength
- 36 dedicated DSP blocks for high-performance signal processing
- 12 PLLs (Phase-Locked Loops) for advanced clock management
Performance Characteristics
The device operates with:
- Core voltage range of 0.86V to 1.15V for power-sensitive applications
- Wide temperature operation from -40 C to 100 C junction temperature
- Typical power consumption of 15W at maximum configuration
- Maximum system frequency of 450MHz for demanding applications
Package and Physical Dimensions
The 1152-FBGA (35x35mm) package features:
- 1mm ball pitch for high-density routing
- Flip-chip technology for improved thermal performance
- Four power banks for flexible voltage configuration
- ESD protection on all I/O pins
Design and Development Support
Engineers working with the EP3SL200F1152I4N can leverage:
- Intel Quartus II design software (version 9.1 or later)
- Pre-verified IP cores for common functions
- Reference designs for PCI Express, DDR memory interfaces
- Signal integrity analysis tools for high-speed designs
Industry Applications
Telecommunications Infrastructure
The FPGA's high logic density makes it ideal for:
- 4G/LTE baseband processing
- Packet switching and routing
- Optical network termination units
Industrial Automation
Wide temperature operation enables use in:
- Motor control systems
- PLC (Programmable Logic Controller) replacements
- Machine vision processing
Military and Aerospace
Despite being obsolete, the device remains in:
- Radar signal processing
- Secure communications systems
- Avionics control units
Migration Path and Alternatives
For new designs, consider these Intel alternatives:
- Stratix 10 (10SX series) for higher performance
- Arria 10 for power-efficient applications
- Cyclone 10 for cost-sensitive designs
Purchasing Considerations
When sourcing EP3SL200F1152I4N:
- Verify supplier authenticity (counterfeit risk)
- Check date codes for remaining product life
- Consider last-time-buy options
- Evaluate refurbished/reconditioned units
For technical documentation or volume pricing inquiries, contact our FPGA specialists today. Our inventory includes tested, guaranteed EP3SL200F1152I4N devices with full traceability.