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EP3SL200F1152I4N FPGA: Specifications, Features, and Applications | Intel Stratix III

EP3SL200F1152I4N FPGA: In-Depth Technical Guide for Engineers

The EP3SL200F1152I4N from Intel's Stratix III family represents a pinnacle of FPGA technology, offering unparalleled flexibility for complex digital designs. Despite its obsolete status, this 1152-FBGA packaged device continues to power critical systems across industries due to its exceptional balance of performance, I/O capability, and on-chip memory.

Detailed Technical Specifications

Architectural Overview

Built on Intel's advanced 65nm process technology, the EP3SL200F1152I4N delivers:

  • 200,000 programmable logic elements organized in 8,000 LABs (Logic Array Blocks)
  • 10.9 million bits of embedded RAM for high-speed data buffering
  • 744 user I/O pins with programmable slew rate and drive strength
  • 36 dedicated DSP blocks for high-performance signal processing
  • 12 PLLs (Phase-Locked Loops) for advanced clock management

Performance Characteristics

The device operates with:

  • Core voltage range of 0.86V to 1.15V for power-sensitive applications
  • Wide temperature operation from -40 C to 100 C junction temperature
  • Typical power consumption of 15W at maximum configuration
  • Maximum system frequency of 450MHz for demanding applications

Package and Physical Dimensions

The 1152-FBGA (35x35mm) package features:

  • 1mm ball pitch for high-density routing
  • Flip-chip technology for improved thermal performance
  • Four power banks for flexible voltage configuration
  • ESD protection on all I/O pins

Design and Development Support

Engineers working with the EP3SL200F1152I4N can leverage:

  • Intel Quartus II design software (version 9.1 or later)
  • Pre-verified IP cores for common functions
  • Reference designs for PCI Express, DDR memory interfaces
  • Signal integrity analysis tools for high-speed designs

Industry Applications

Telecommunications Infrastructure

The FPGA's high logic density makes it ideal for:

  • 4G/LTE baseband processing
  • Packet switching and routing
  • Optical network termination units

Industrial Automation

Wide temperature operation enables use in:

  • Motor control systems
  • PLC (Programmable Logic Controller) replacements
  • Machine vision processing

Military and Aerospace

Despite being obsolete, the device remains in:

  • Radar signal processing
  • Secure communications systems
  • Avionics control units

Migration Path and Alternatives

For new designs, consider these Intel alternatives:

  • Stratix 10 (10SX series) for higher performance
  • Arria 10 for power-efficient applications
  • Cyclone 10 for cost-sensitive designs

Purchasing Considerations

When sourcing EP3SL200F1152I4N:

  • Verify supplier authenticity (counterfeit risk)
  • Check date codes for remaining product life
  • Consider last-time-buy options
  • Evaluate refurbished/reconditioned units

For technical documentation or volume pricing inquiries, contact our FPGA specialists today. Our inventory includes tested, guaranteed EP3SL200F1152I4N devices with full traceability.

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