EP4CE115F23I7N FPGA: Intel's High-Performance Cyclone IV Solution for Advanced Embedded Designs

The EP4CE115F23I7N represents Intel's commitment to delivering powerful, flexible Field Programmable Gate Array (FPGA) solutions for today's most demanding embedded applications. As part of the renowned Cyclone IV family, this FPGA combines exceptional processing capabilities with energy efficiency, making it a top choice for engineers across multiple industries.

Comprehensive Product Overview

Manufacturer and Series Details

Developed by Intel Corporation, a global semiconductor leader, the EP4CE115F23I7N belongs to the Cyclone IV E series, known for its optimal balance between performance and power consumption. With an Active product status, this FPGA remains fully supported with regular updates and long-term availability.

Product Classification

This device falls under:

• Primary Category: Integrated Circuits (ICs)
• Subcategory: Embedded - FPGAs (Field Programmable Gate Array)
• Application Focus: High-performance digital systems requiring hardware customization

Detailed Technical Specifications

Advanced Logic Architecture

The EP4CE115F23I7N features:

• 7,155 Logic Array Blocks (LABs) providing flexible logic implementation
• 114,480 Logic Elements for complex digital circuitry
• Advanced routing resources for optimal signal integrity

Memory Resources

With 3,981,312 RAM bits (approximately 497KB), this FPGA offers:

• Dedicated memory blocks for efficient data storage
• Configurable as true dual-port memory
• Support for various memory configurations including FIFO implementations

Comprehensive I/O Capabilities

The device provides 280 user I/O pins featuring:

• Programmable I/O standards (LVCMOS, LVDS, SSTL, HSTL)
• Adjustable drive strength and slew rate
• On-chip termination for signal integrity

Power Efficiency

Operating at 1.15V to 1.25V core voltage, this FPGA delivers:

• Industry-leading power efficiency
• Advanced power management features
• Low static power consumption

Robust Packaging

The 484-FBGA (23x23) package offers:

• Surface-mount compatibility for automated assembly
• 1.0mm ball pitch for high-density designs
• Enhanced thermal performance

Environmental Specifications

Rated for -40 C to 100 C junction temperature, making it suitable for:

• Industrial automation
• Outdoor telecommunications equipment
• Automotive under-hood applications

Target Applications and Use Cases

Telecommunications Infrastructure

Ideal for:

• 4G/5G baseband processing
• Software-defined radio (SDR) implementations
• Network protocol conversion bridges

Automotive Electronics

Perfect for:

• Advanced Driver Assistance Systems (ADAS)
• In-vehicle infotainment processing
• Automotive sensor fusion applications

Industrial Automation

Excellent for:

• Real-time motor control systems
• Machine vision processing
• Industrial networking solutions

Aerospace and Defense

Suited for:

• Radar signal processing
• Secure communications systems
• Flight control systems

Consumer Electronics

Applicable in:

• Ultra-HD video processing
• AI-powered edge devices
• Next-generation gaming systems

Competitive Advantages

1. Superior Logic Density: With over 114k logic elements, it handles complex algorithms more efficiently than competing FPGAs in its class.
2. Enhanced Memory Resources: Nearly 4Mbit of on-chip memory reduces external memory requirements.
3. Power-Optimized Architecture: Delivers up to 30% lower power consumption than previous generations.
4. Design Security: Advanced security features including configuration bitstream encryption.
5. Comprehensive Development Support: Backed by Intel's Quartus Prime design software and extensive IP library.

Design Considerations

Development Tools

Intel provides:

• Quartus Prime Software Suite
• ModelSim simulation tools
• DSP Builder for signal processing
• Nios II Embedded Design Suite

Power Management

Recommendations for optimal performance:

• Use high-quality switching regulators for core voltage
• Implement proper decoupling capacitor networks
• Consider power sequencing requirements

Signal Integrity

Best practices include:

• Proper PCB layer stackup design
• Controlled impedance routing for high-speed signals
• Use of Intel's recommended termination schemes

Conclusion

The EP4CE115F23I7N FPGA stands as a testament to Intel's innovation in programmable logic technology. Combining high logic density with power efficiency and robust I/O capabilities, this device empowers engineers to create cutting-edge solutions across telecommunications, automotive, industrial, and consumer markets. Its 484-FBGA package offers the perfect balance between pin count and board space requirements, while the wide temperature range ensures reliability in challenging environments.

For designers seeking a cost-effective yet powerful FPGA solution, the EP4CE115F23I7N delivers exceptional value. Its compatibility with Intel's comprehensive development ecosystem significantly reduces time-to-market while providing access to a wealth of intellectual property and reference designs.

Ready to incorporate this high-performance FPGA into your next design? Order the EP4CE115F23I7N today and leverage Intel's proven FPGA technology to create innovative, market-leading products. Our inventory includes genuine Intel components with full traceability and technical support to ensure your project's success.