PI3EQX1002B1ZLEX: Advanced USB 3.1 Signal Buffer & ReDriver IC by Diodes Incorporated

Overview

The PI3EQX1002B1ZLEX is a state-of-the-art signal conditioning IC from Diodes Incorporated, engineered to optimize USB 3.1 Gen 2 (10Gbps) data transmission. As a buffer and ReDriver, it combats signal degradation in high-speed interfaces, making it indispensable for modern electronics demanding robust connectivity.

Technical Deep Dive

Key Specifications

• Data Rate: 10Gbps (Supports USB 3.1 Gen 2, DisplayPort, Thunderbolt)
• I/O Type: CML (Current Mode Logic) for low-noise operation
• Channels: Single-channel with 2.0ns ultra-low latency
• Power: 3V 3.6V supply, optimized for energy efficiency
• Package: 30-TQFN (2.5x4.5mm), RoHS-compliant

Signal Integrity Features

The IC integrates adaptive input equalization to compensate for channel loss and output de-emphasis to reduce inter-symbol interference (ISI). Its programmable settings allow customization for cable lengths up to 5 meters without sacrificing performance.

Applications

Primary Use Cases

1. Consumer Electronics: Laptops, docking stations, and SSDs requiring stable USB-C connections
2. Data Centers: Active optical cables (AOCs) and server backplanes
3. Automotive: Infotainment systems with USB 3.1 video streaming

Comparative Advantage

Unlike competitors, the PI3EQX1002B1ZLEX offers auto-negotiation for speed detection and low-power modes (1.5mW in standby), critical for battery-powered devices.

Design Integration

Layout Guidelines

• Place within 5mm of USB connector to minimize trace loss
• Use 4-layer PCB with controlled impedance (90 differential)
• Implement thermal vias for the exposed pad ( JA: 28 C/W)

Compliance & Certifications

Meets USB-IF 3.1, IEEE 802.3bj, and CE standards. Reference designs available for FCC/EMI optimization.

Why Engineers Choose PI3EQX1002B1ZLEX

With 92% lower bit-error-rate (BER) versus passive solutions and industry-leading ESD protection ( 8kV HBM), this IC reduces development cycles while future-proofing designs for emerging protocols like USB4.

Purchasing & Support

Available through authorized distributors with volume pricing (1k units @ $1.85/unit). Diodes Inc provides SPICE models and evaluation boards (PI3EQX1002BEVAL1) for rapid prototyping.

Conclusion

The PI3EQX1002B1ZLEX redefines signal integrity for high-speed interfaces, combining 10Gbps performance, design flexibility, and power efficiency in a compact footprint. Its compliance with USB 3.1 Gen 2 ensures seamless integration into next-generation systems.