XC6VLX550T-1FFG1759C FPGA: High-Performance Embedded Solution by AMD Xilinx

The XC6VLX550T-1FFG1759C is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx, designed to meet the demands of complex digital systems. This high-performance IC offers unparalleled flexibility and scalability, making it an ideal choice for applications ranging from telecommunications to aerospace and defense. Below, we delve into the key features, specifications, and applications of this advanced FPGA.

Product Overview

Manufacturer & Category

The XC6VLX550T-1FFG1759C belongs to the Integrated Circuits (ICs) category under the subcategory of Embedded - FPGAs (Field Programmable Gate Array). Manufactured by AMD Xilinx, a global leader in programmable logic devices, this FPGA combines advanced technology with robust performance capabilities.

Product Status

This product is currently Active, ensuring availability for both current and future projects. AMD Xilinx provides long-term support, making it a reliable choice for mission-critical applications.

Detailed Specifications

Logic Resources

• Number of LABs/CLBs: 42,960
• Number of Logic Elements/Cells: 549,888

These extensive logic resources enable designers to implement highly complex digital circuits, including custom processors, DSP algorithms, and high-speed interfaces. The large number of Configurable Logic Blocks (CLBs) ensures flexibility for diverse applications.

Memory Resources

• Total RAM Bits: 23,298,048

With over 23 million bits of RAM, the XC6VLX550T-1FFG1759C is ideal for data-intensive tasks such as real-time signal processing, video streaming, and artificial intelligence (AI) workloads.

I/O Capabilities

• Number of I/O Pins: 840

The FPGA supports up to 840 I/O pins, providing extensive connectivity for high-speed serial transceivers, memory interfaces (DDR3/4), and peripheral integration. This makes it suitable for systems requiring multi-gigabit data transfer.

Power Efficiency

• Voltage - Supply: 0.95V ~ 1.05V

Operating at a low voltage range ensures energy-efficient performance, reducing thermal dissipation and power costs. This is critical for battery-powered and thermally constrained environments.

Robust Packaging

• Package/Case: 1759-BBGA, FCBGA
• Supplier Device Package: 1759-FCBGA (42.5x42.5 mm)

The Fine-Pitch Ball Grid Array (FBGA) packaging ensures superior signal integrity and thermal management. The compact 42.5x42.5 mm footprint is optimized for high-density PCB designs.

Operating Conditions

• Temperature Range: 0 C ~ 85 C (TJ)

Designed for industrial-grade reliability, this FPGA operates flawlessly in harsh environments, including outdoor and automotive applications.

Applications

The XC6VLX550T-1FFG1759C is versatile enough for:

• 5G Telecommunications: Baseband processing, beamforming, and network acceleration.
• Aerospace & Defense: Radar systems, secure communications, and avionics.
• Medical Imaging: MRI, ultrasound, and real-time diagnostic equipment.
• Industrial IoT: Predictive maintenance, robotics, and automation.
• AI & Machine Learning: Edge inference and neural network acceleration.

Competitive Advantages

1. Scalability: Reconfigure logic and I/O to adapt to evolving requirements.
2. High-Speed Performance: Supports protocols like PCIe Gen3, SATA, and 10G Ethernet.
3. Longevity: AMD Xilinx s commitment to product lifecycle stability.
4. Ecosystem Support: Comprehensive development tools (Vivado, SDK) and IP cores.

Conclusion

The XC6VLX550T-1FFG1759C FPGA by AMD Xilinx is a powerhouse for next-generation embedded systems. Its blend of high logic density, memory capacity, and I/O flexibility makes it a top choice for engineers tackling complex challenges in telecom, defense, and AI. With AMD Xilinx s proven reliability, this FPGA ensures your designs are future-proof.

Call to Action: Ready to integrate the XC6VLX550T-1FFG1759C into your project? Contact our sales team for pricing, samples, and technical support. Explore our resource library for datasheets, reference designs, and application notes.