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XC7K325T-1FBG676C FPGA: High-Performance Embedded Solution by AMD Xilinx | Features & Applications

XC7K325T-1FBG676C FPGA: High-Performance Embedded Solution by AMD Xilinx

The XC7K325T-1FBG676C is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx, designed to deliver unparalleled performance, flexibility, and power efficiency for advanced embedded applications. This comprehensive guide explores its specifications, benefits, and use cases to help engineers and developers make informed decisions.

Product Overview

Manufacturer and Product Status

Manufactured by AMD Xilinx, a leader in programmable logic devices, the XC7K325T-1FBG676C is part of the Kintex-7 family. Its Active status ensures long-term availability and support, making it a future-proof investment.

FPGA Architecture and Core Specifications

  • Logic Cells: 326,080
  • CLBs (Configurable Logic Blocks): 25,475
  • DSP Slices: 840 (for high-speed math operations)
  • Block RAM: 16.4 Mb (16,404,480 bits)
  • Clock Management Tiles: 10 (with PLLs and DLLs)

This FPGA leverages 28nm process technology, balancing performance and power efficiency. Its hierarchical architecture enables complex designs while minimizing latency.

Memory and Storage

The XC7K325T-1FBG676C features:

  • 16.4 Mb block RAM for on-chip data storage
  • 1,200 Kb distributed RAM for flexible memory allocation
  • Support for external DDR3/DDR2/LPDDR2 memory interfaces

I/O and Connectivity

  • 400 user I/O pins with programmable standards (LVDS, LVCMOS, etc.)
  • 16 GTX transceivers (up to 12.5 Gbps each)
  • PCI Express Gen2/Gen3 endpoint support
  • Ethernet MAC blocks for network applications

Power Efficiency

  • 0.97V to 1.03V core voltage for reduced power consumption
  • 28nm HPL (High Performance Low Power) process
  • Advanced power gating techniques

Physical Characteristics

  • Package: 676-pin FCBGA (27x27mm)
  • Mounting: Surface-mount (SMT)
  • Operating Temperature: 0 C to 85 C (TJ)

Why Choose the XC7K325T-1FBG676C?

Performance Advantages

With 326,080 logic cells and 840 DSP slices, this FPGA handles complex algorithms for:

  • Real-time signal processing
  • High-speed data acquisition
  • Machine learning inference

Design Flexibility

The reprogrammable nature allows for:

  • Field updates without hardware changes
  • Prototyping multiple designs on the same hardware
  • Custom logic implementation

System Integration

Integrated features reduce BOM costs:

  • Clock management (10 CMTs)
  • High-speed serial transceivers
  • Memory controllers

Applications

Telecommunications

  • 4G/5G baseband processing
  • Optical transport networks
  • Protocol conversion bridges

Automotive Systems

  • ADAS sensor fusion
  • In-vehicle networking
  • Autonomous driving subsystems

Aerospace and Defense

  • Radar signal processing
  • Secure communications
  • Avionics systems

Industrial Automation

  • Machine vision systems
  • Motor control
  • PLC implementations

Consumer Electronics

  • Ultra HD video processing
  • Augmented reality systems
  • High-end audio equipment

Development Ecosystem

AMD Xilinx provides comprehensive tools:

  • Vivado Design Suite for synthesis and implementation
  • SDK for embedded software development
  • IP Catalog with pre-verified functions
  • Reference designs for common applications

Conclusion

The XC7K325T-1FBG676C FPGA represents the perfect balance of performance, power efficiency, and flexibility for demanding embedded applications. With its robust architecture, ample resources, and comprehensive development tools, it enables innovation across industries from telecommunications to aerospace.

For engineers seeking a reliable, high-performance FPGA solution, the XC7K325T-1FBG676C delivers:

  • Superior processing capabilities
  • Low power consumption
  • Future-proof programmability
  • Strong ecosystem support

Ready to start your design? Contact us today for pricing, availability, and technical support for the XC7K325T-1FBG676C FPGA solution.

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