XC7K325T-1FBG900C FPGA: The Ultimate High-Performance Solution for Demanding Embedded Applications

The XC7K325T-1FBG900C from AMD Xilinx represents the pinnacle of FPGA technology, offering unparalleled performance and flexibility for today's most challenging embedded system designs. As part of the Kintex-7 family, this advanced FPGA delivers the perfect balance of power efficiency, processing capability, and cost-effectiveness for applications ranging from 5G infrastructure to autonomous vehicle systems.

Comprehensive Technical Specifications

Advanced Architecture Details

• FPGA Series: Kintex-7 (28nm High-Performance Class)
• Logic Cells: 326,080 (25,475 CLBs)
• DSP Slices: 840 (for high-speed mathematical operations)
• Clock Management Tiles: 10 (with advanced PLL and DLL capabilities)

Memory Architecture

• Block RAM: 16,404,480 bits (445 blocks of 36Kb each)
• UltraRAM: Not available in this model
• Configuration Memory: Supports multiple loading modes including SPI flash

Power Efficiency Features

• Core Voltage: 0.97V to 1.03V (optimized for low power)
• Power Estimation: Typical designs consume 10-25W depending on utilization
• Power Optimization: Supports clock gating and power-aware routing

Package and Physical Characteristics

Advanced Packaging Technology

• Package Type: 900-ball Fine-Pitch Ball Grid Array (FBGA)
• Package Dimensions: 31mm x 31mm with 1mm ball pitch
• Interconnect Technology: Flip-chip design for improved thermal performance
• I/O Banks: 16 banks with high-speed serial transceivers

Performance Benchmarks and Comparisons

Processing Throughput

• Maximum Logic Performance: Up to 550MHz for critical paths
• DSP Performance: 2.2 TMACs (Tera Multiply-Accumulates per second)
• Memory Bandwidth: Over 1.6Tbps total memory bandwidth

Comparison with Competing FPGAs

Feature	XC7K325T	Competitor A	Competitor B
Logic Cells	326,080	250,000	280,000
DSP Slices	840	640	720
Power Efficiency	Best in Class	Good	Average

Design Tools and Development Ecosystem

Supported Development Environments

• Vivado Design Suite: Complete design environment with synthesis and implementation
• SDK/SDSoC: For embedded processor development
• Third-Party Tools: Support for Mentor Graphics, Synopsys, and Cadence tools

Reference Designs and IP Cores

• Pre-verified IP Blocks: PCIe Gen2/3, DDR3/4, Ethernet, USB
• Machine Learning Accelerators: Pre-optimized neural network processing blocks
• Signal Processing Libraries: FFT, FIR, and other DSP functions

Industry-Specific Applications

Telecommunications Solutions

• 5G Baseband Processing: Ideal for massive MIMO and beamforming
• Packet Processing: High-speed routing at 100Gbps+
• Network Function Virtualization: Flexible acceleration for virtualized services

Automotive Innovations

• ADAS Processing: Sensor fusion for autonomous driving
• In-Vehicle Networking: Gateway functionality for CAN, Ethernet
• Infotainment Systems: High-resolution video processing

Aerospace and Defense

• Radar Processing: Real-time signal analysis
• Secure Communications: Cryptographic acceleration
• Space-Grade Designs: Radiation-tolerant implementations

Purchasing and Support Information

Our company offers comprehensive support for the XC7K325T-1FBG900C including:

• Volume Pricing: Competitive rates for production quantities
• Technical Support: FPGA design experts available
• Evaluation Kits: KC705 development board options
• Lead Time: Typically 6-8 weeks for production quantities

Future-Proof Your Designs

The XC7K325T-1FBG900C provides a migration path to newer Xilinx UltraScale+ devices while offering the best cost/performance ratio in its class. With AMD Xilinx's long-term product support commitment, you can design with confidence knowing your investment is protected.

Call to Action: Contact our sales team today to discuss how the XC7K325T-1FBG900C can accelerate your next design project. Request a free technical consultation or sample availability information.