XC7Z045-1FFG900C: A High-Performance System on Chip (SoC) by AMD Xilinx

The XC7Z045-1FFG900C is a cutting-edge System on Chip (SoC) developed by AMD Xilinx, renowned for its robust architecture and versatility. This SoC integrates advanced processing capabilities with FPGA programmability, making it an ideal solution for a wide range of applications, from industrial automation to aerospace and defense.

Overview

Manufacturer and Product Status

Manufactured by AMD Xilinx, the XC7Z045-1FFG900C is currently marked as Active, ensuring its availability for ongoing projects and future developments.

Category and Architecture

This product falls under the broader category of Integrated Circuits (ICs) and more specifically within the subcategory of Embedded - System On Chip (SoC). The architecture combines both MCU (Microcontroller Unit) and FPGA (Field Programmable Gate Array) functionalities, offering unparalleled flexibility and performance.

Key Features

Processor Core

At the heart of the XC7Z045-1FFG900C lies the Dual ARM Cortex-A9 MPCore with CoreSight processor. This powerful dual-core processor operates at a speed of 667MHz, delivering high computational power while maintaining efficiency.

Memory Configuration

• Flash Size: Not applicable (-)
• RAM Size: 256KB

While the Flash memory size is not specified, the device boasts a 256KB RAM, which is sufficient for many embedded applications requiring real-time data processing and storage.

Peripherals and Connectivity

The XC7Z045-1FFG900C is equipped with a rich set of peripherals and connectivity options: - Peripherals: DMA (Direct Memory Access) - Connectivity: - CANbus - EBI/EMI (External Bus Interface / External Memory Interface) - Ethernet - I2C (Inter-Integrated Circuit) - MMC/SD/SDIO (MultiMediaCard/Secure Digital/Secure Digital Input Output) - SPI (Serial Peripheral Interface) - UART/USART (Universal Asynchronous Receiver/Transmitter) - USB OTG (On-The-Go)

These features make the SoC highly versatile, capable of interfacing with a wide array of external devices and networks.

Primary Attributes

One of the standout features of this SoC is the integration of the Kintex-7 FPGA with 350K Logic Cells. This allows for extensive customization and reconfigurability, enabling developers to tailor the hardware to specific application requirements.

Operating Temperature

Designed for reliability in various environments, the XC7Z045-1FFG900C operates effectively within a temperature range of 0 C ~ 85 C (TJ), making it suitable for both indoor and outdoor applications.

Package Information

• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

The Ball Grid Array (BGA) packaging ensures excellent electrical and thermal performance, crucial for high-density and high-speed applications.

Applications

Given its powerful combination of processing capabilities and FPGA programmability, the XC7Z045-1FFG900C is well-suited for a variety of demanding applications, including but not limited to: - Industrial Automation: Leveraging its robust connectivity and processing power for complex control systems. - Medical Devices: Utilizing its real-time processing capabilities for diagnostic and monitoring equipment. - Aerospace and Defense: Benefiting from its high-performance computing and reconfigurable logic for mission-critical systems. - Automotive: Enabling advanced driver-assistance systems (ADAS) and in-vehicle networking. - Communications: Supporting high-speed data processing and signal integrity in networking equipment.

Technical Specifications

Feature	Specification
Processor	Dual ARM Cortex-A9 MPCore @ 667MHz
FPGA	Kintex-7 with 350K Logic Cells
RAM	256KB
Connectivity	CANbus, Ethernet, USB OTG, SPI, I2C, UART/USART
Operating Temperature	0 C ~ 85 C (TJ)
Package	900-FCBGA (31x31)

Why Choose XC7Z045-1FFG900C?

The XC7Z045-1FFG900C stands out in the crowded SoC market due to its: - High Performance: Dual-core ARM Cortex-A9 and FPGA integration deliver unmatched processing power. - Flexibility: Reconfigurable FPGA allows for custom hardware acceleration. - Robust Connectivity: Comprehensive I/O options ensure seamless integration with peripherals. - Reliability: Designed to operate in harsh environments with a wide temperature range.

Conclusion

The XC7Z045-1FFG900C by AMD Xilinx represents a significant advancement in SoC technology, blending high-performance processing with flexible FPGA capabilities. Its comprehensive feature set and wide application scope make it an attractive choice for engineers and developers seeking to push the boundaries of embedded system design. Whether you're designing for industrial, medical, or aerospace applications, the XC7Z045-1FFG900C offers the performance and flexibility needed to bring your vision to life.

For those looking to integrate this powerful SoC into their projects, consider purchasing through our online platform, where we offer competitive pricing and reliable service to ensure your project's success.