XC7Z100-2FFG900I: A High-Performance System on Chip (SoC) by AMD Xilinx

The XC7Z100-2FFG900I is a cutting-edge Integrated Circuit (IC) designed and manufactured by AMD Xilinx, a global leader in advanced semiconductor solutions. This product belongs to the category of Embedded - System On Chip (SoC), making it an ideal choice for applications that require both high computational power and flexible programmability. Below, we delve into the key features and specifications of this IC, highlighting its capabilities and versatility.

Manufacturer Overview

AMD Xilinx, renowned for its innovative FPGA and SoC solutions, has crafted the XC7Z100-2FFG900I with precision and reliability. As part of their Zynq-7000 series, this SoC combines the best of ARM Cortex-A9 processing with FPGA programmability, offering users unparalleled flexibility and performance.

Key Specifications

Architecture

The XC7Z100-2FFG900I boasts a dual-core ARM Cortex-A9 MPCore processor integrated with CoreSight technology. This architecture ensures efficient multitasking and high-speed data processing, making it suitable for complex embedded systems. Additionally, the inclusion of a Kintex-7 FPGA with 444K Logic Cells provides extensive reconfigurable logic resources, enabling custom hardware acceleration for specific tasks.

Processor Cores

With its dual-core configuration, the XC7Z100-2FFG900I delivers exceptional performance at a clock speed of 800MHz. The ARM Cortex-A9 cores are optimized for low power consumption while maintaining high throughput, making them perfect for real-time applications such as industrial automation, automotive systems, and medical devices.

Memory Configuration

This SoC includes 256KB of RAM, providing sufficient onboard memory for executing critical operations without relying heavily on external storage. Although flash memory is not included in this model, users can integrate additional non-volatile memory through peripheral interfaces if needed.

Peripherals and Connectivity

One of the standout features of the XC7Z100-2FFG900I is its rich set of peripherals and connectivity options: - DMA (Direct Memory Access) allows for efficient data transfer between peripherals and memory. - Connectivity protocols include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, ensuring seamless communication with various devices and networks.

These features make the XC7Z100-2FFG900I highly adaptable to diverse environments, from IoT gateways to networking equipment.

Package Details

The XC7Z100-2FFG900I comes in a 900-BBGA (31x31 mm) package, also known as FCBGA (Flip-Chip Ball Grid Array). This compact yet robust packaging solution facilitates easy integration into modern PCB designs while maintaining excellent thermal and electrical performance.

Operating Temperature Range

Designed for rugged conditions, the XC7Z100-2FFG900I operates reliably within a temperature range of -40 C to 100 C (TJ). This wide operating temperature ensures stability even under extreme environmental conditions, enhancing its suitability for outdoor and industrial applications.

Applications

Given its powerful combination of ARM Cortex-A9 processors and FPGA fabric, the XC7Z100-2FFG900I finds application in numerous fields: - Industrial Automation: Real-time control and monitoring systems. - Automotive Systems: Advanced driver assistance systems (ADAS) and infotainment platforms. - Medical Devices: Imaging and diagnostic equipment requiring high computational power. - Networking Equipment: Routers, switches, and gateways demanding versatile connectivity.

Product Status and Availability

Currently marked as Active, the XC7Z100-2FFG900I is readily available for purchase. Its active status assures customers of continued support and updates from AMD Xilinx, ensuring long-term viability for your projects.

Why Choose the XC7Z100-2FFG900I?

The XC7Z100-2FFG900I stands out in the crowded SoC market due to its: - High Performance: Dual-core ARM Cortex-A9 and FPGA fabric for accelerated processing. - Flexibility: Reconfigurable logic for custom hardware implementations. - Robust Connectivity: Supports a wide range of communication protocols. - Reliability: Operates in extreme temperatures, ideal for harsh environments.

Conclusion

In summary, the XC7Z100-2FFG900I represents a pinnacle of engineering excellence, combining the strengths of ARM Cortex-A9 processors and Kintex-7 FPGA technology. Whether you're designing sophisticated embedded systems or developing next-generation networking solutions, this SoC offers the performance, flexibility, and reliability required to meet today's most challenging demands.

To learn more about the XC7Z100-2FFG900I or place an order, visit our website where you'll find detailed technical documentation, pricing information, and customer support resources. Let us help you bring your innovative ideas to life with AMD Xilinx's premier System on Chip technology!