XCKU3P-2FFVB676I FPGA: High-Performance, Feature-Rich Solution from AMD Xilinx

The XCKU3P-2FFVB676I is a cutting-edge Field Programmable Gate Array (FPGA) designed by AMD Xilinx, a leader in semiconductor innovation. Part of the Ultrascale+ Kintex series, this FPGA delivers unmatched performance, flexibility, and power efficiency for advanced applications in telecommunications, automotive, aerospace, and IoT. Below, we explore its specifications, features, and why it s a top choice for engineers worldwide.

XCKU3P-2FFVB676I FPGA Overview

Manufacturer and Series

• Manufacturer: AMD Xilinx (formerly Xilinx, now part of AMD)
• Series: Kintex Ultrascale+
• Category: Integrated Circuits (ICs) Embedded FPGAs

The XCKU3P-2FFVB676I is a flagship FPGA in the Kintex Ultrascale+ family, combining high logic density with low power consumption. Its reprogrammable nature makes it ideal for prototyping, acceleration, and real-time processing.

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Key Features and Specifications

1. Advanced Logical Architecture

• Logic Cells: 355,950
• CLBs (Configurable Logic Blocks): 20,340
• DSP Slices: 1,920 (for high-speed math operations)

With 355K logic cells, this FPGA handles complex algorithms, AI/ML workloads, and high-speed data processing. The DSP slices accelerate mathematical computations, making it perfect for 5G, radar, and imaging systems.

2. Memory Resources

• Total RAM Bits: 31.6 Mb (31,641,600 bits)
• UltraRAM Blocks: 64 (for large-scale memory needs)

The generous embedded memory supports buffering, lookup tables, and data-intensive applications like video processing and packet routing.

3. High-Speed I/O and Interfaces

• I/O Pins: 280
• Transceivers: Up to 16.3 Gbps (supports PCIe Gen3, 100G Ethernet)
• Protocol Support: DDR4, HDMI 2.0, USB 3.0

The FPGA s high-speed transceivers enable rapid data transfer, while multi-protocol support ensures compatibility with modern peripherals.

4. Power Efficiency

• Voltage Range: 0.825V 0.876V
• Power Optimization: Advanced 16nm FinFET+ technology

Despite its performance, the XCKU3P-2FFVB676I operates at low voltages, reducing thermal footprint and energy costs.

5. Robust Operating Conditions

• Temperature Range: -40 C to +100 C (TJ)
• Package: 676-FCBGA (27x27 mm, fine-pitch BGA)

Its industrial-grade temperature tolerance and compact FCBGA package suit harsh environments like automotive and aerospace.

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Applications of XCKU3P-2FFVB676I

1. 5G and Wireless Communication

Used in base stations, beamforming, and mmWave systems due to its high-speed transceivers and DSP capabilities.

2. AI and Machine Learning

Accelerates neural networks and edge AI with parallel processing and low-latency memory.

3. Automotive ADAS

Powers LiDAR, autonomous driving systems, and in-vehicle networks with real-time processing.

4. Aerospace & Defense

Ideal for radar, satellite comms, and secure encryption due to reliability and performance.

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Why Choose XCKU3P-2FFVB676I?

• Scalability: From edge devices to data centers.
• Tool Support: Compatible with Vivado Design Suite for seamless development.
• Future-Proof: Supports evolving standards like PCIe 4.0 and 400G Ethernet.

Order the XCKU3P-2FFVB676I today to leverage AMD Xilinx s cutting-edge FPGA technology for your next project!

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Conclusion

The XCKU3P-2FFVB676I FPGA stands out as a versatile, high-performance solution for modern engineering challenges. Its blend of logic density, memory, and power efficiency makes it a go-to for industries demanding reliability and speed. For pricing, samples, or technical support, contact our team or visit our product page.