XCVU9P-2FLGC2104I FPGA: High-Performance, Feature-Rich Solution from AMD Xilinx

The XCVU9P-2FLGC2104I is a cutting-edge Field Programmable Gate Array (FPGA) manufactured by AMD Xilinx, designed to deliver unparalleled performance and flexibility for advanced computing and embedded applications. This FPGA is part of the UltraScale+ family, known for its high logic density, energy efficiency, and robust I/O capabilities. Below, we explore its features, specifications, and applications in detail to help you understand why it stands out in the competitive FPGA market.

Overview

The XCVU9P-2FLGC2104I is classified under Integrated Circuits (ICs) and specifically falls into the Embedded - FPGAs (Field Programmable Gate Array) subcategory. It is currently marked as Active, ensuring availability for procurement and integration into high-performance systems. This FPGA is engineered to meet the demands of modern applications, including AI inference, 5G networking, and data center acceleration.

Key Features and Specifications

1. Advanced Logic Resources

• Number of LABs/CLBs: 147,780
• Number of Logic Elements/Cells: 2,586,150
• Look-Up Tables (LUTs): 1,293,075
• Flip-Flops: 2,586,150

The XCVU9P-2FLGC2104I boasts an impressive 2.5 million logic cells, making it one of the most powerful FPGAs in its class. This high logic density enables the implementation of complex algorithms, parallel processing, and real-time data analysis. The device is particularly well-suited for applications requiring high-throughput signal processing and machine learning acceleration.

2. Extensive Memory Resources

• Total RAM Bits: 391,168,000 (approx. 391 Mb)
• UltraRAM Blocks: 360 (32.5 Mb total)
• Block RAM (36 Kb each): 2,160 (77.8 Mb total)

With nearly 400 million bits of on-chip memory, this FPGA provides ample storage for buffering high-speed data streams and implementing memory-intensive applications. The inclusion of UltraRAM blocks further enhances its capability to handle large datasets, making it ideal for big data analytics and video processing.

3. High-Speed I/O and Interfacing

• Number of I/O Pins: 416
• High-Speed Transceivers: Up to 32 Gbps per lane
• PCIe Gen3/Gen4 Support: Yes
• DDR4 Memory Interface: Up to 2666 Mbps

The FPGA supports 416 I/O pins and features high-speed transceivers capable of data rates up to 32 Gbps. This makes it perfect for interfacing with high-bandwidth peripherals, such as optical modules, ADCs/DACs, and memory controllers. Additionally, its support for PCIe Gen4 ensures seamless integration into data center and server environments.

4. Power Efficiency

• Voltage - Supply: 0.825V ~ 0.876V
• Power Consumption: Optimized for low-power operation
• Dynamic Power Management: Supported

The XCVU9P-2FLGC2104I operates at a low voltage range, contributing to its energy-efficient performance. Advanced power management features allow for dynamic adjustment of power consumption based on workload, making it suitable for portable and battery-operated devices.

5. Robust Operating Conditions

• Operating Temperature Range: -40 C ~ 100 C (TJ)
• Humidity Tolerance: Up to 85% non-condensing

Designed for reliability in harsh environments, this FPGA operates across a wide temperature range and can withstand high humidity levels. This makes it ideal for industrial automation, automotive, and aerospace applications.

6. Packaging and Mounting

• Package / Case: 2104-BBGA, FCBGA
• Supplier Device Package: 2104-FCBGA (47.5x47.5)
• Mounting Type: Surface Mount

The FPGA is housed in a 2104-FineLine BGA (FCBGA) package, which offers excellent thermal dissipation and electrical performance. Its surface-mount design simplifies PCB assembly and reduces the overall footprint of the system.

Applications

The XCVU9P-2FLGC2104I is versatile and can be deployed in a wide range of high-performance applications, including:

• Data Center Acceleration: Offloading CPU tasks to FPGA for faster processing.
• 5G Wireless Infrastructure: Baseband processing and beamforming.
• AI and Machine Learning: Real-time inference and neural network acceleration.
• Medical Imaging: High-resolution ultrasound and MRI processing.
• Automotive ADAS: Sensor fusion and autonomous driving algorithms.

Why Choose the XCVU9P-2FLGC2104I?

The XCVU9P-2FLGC2104I stands out due to its:

• Unmatched Logic Density: 2.5M logic cells for complex designs.
• High-Speed Connectivity: 32 Gbps transceivers and PCIe Gen4 support.
• Scalability: Suitable for both prototyping and mass production.
• Reliability: Robust operating conditions for industrial use.

Conclusion

The XCVU9P-2FLGC2104I from AMD Xilinx is a top-tier FPGA designed for next-generation applications. Its combination of high logic density, extensive memory, and high-speed I/O makes it a preferred choice for engineers working on AI, 5G, and data center solutions. Whether you're developing cutting-edge technology or optimizing existing systems, this FPGA delivers the performance and flexibility you need.

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