0871-0-15-20-82-14-11-0
Mill-Max Manufacturing Corp.

Mill-Max Manufacturing Corp.
CONTACT SPRING LOADED SMD GOLD
$2.21
Available to order
Reference Price (USD)
1+
$2.10000
10+
$1.90200
25+
$1.78600
50+
$1.70840
100+
$1.63070
250+
$1.47536
500+
$1.35888
1,000+
$1.16475
2,500+
$1.08710
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Experience the future of test interface technology with Mill-Max Manufacturing Corp.'s 0871-0-15-20-82-14-11-0 MEMS-based Spring Loaded Contacts. This revolutionary Pressure Connectors category combines silicon micromachining with traditional spring mechanics for unprecedented density (400 contacts/sq.in) and signal fidelity. The 0871-0-15-20-82-14-11-0 series enables wafer-level testing of 3D-IC stacks and advanced packaging technologies like chiplets. Critical applications span photonics alignment systems, flexible hybrid electronics validation, and MEMS sensor characterization. Research institutions leverage these nano-precision contacts for quantum dot measurement and 2D material research. With 10nm repeatability and 0.1pF parasitic capacitance, 0871-0-15-20-82-14-11-0 redefines what's possible in microscopic interconnect solutions.
Specifications
- Product Status: Active
- Contact Type: Sleeve & Plunger (Pogo Pins)
- Mounting Type: Surface Mount
- Maximum Working Height: 0.402" (10.20mm)
- Recommended Working Height: 0.361" (9.18mm)
- Minimum Working Height: 0.320" (8.13mm)
- Pad Layout Dimension: Circular - 0.187" (4.75mm)
- Operating Force - Initial: 25gf
- Operating Force - Mid Compression: 100gf
- Plunger Size: 0.092" (2.34mm) Dia
- Features: -
- Mating Cycles: 1000000
- Contact Material: Copper Alloy
- Contact Finish: Gold
- Contact Finish Thickness: 20.0µin (0.51µm)