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24-6574-18

Aries Electronics
24-6574-18 Preview
Aries Electronics
CONN IC DIP SOCKET ZIF 24POS TIN
$105.54
Available to order
Reference Price (USD)
12+
$70.53750
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram

Specifications

  • Product Status: Active
  • Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 24 (2 x 12)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 200.0µin (5.08µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200.0µin (5.08µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
  • Operating Temperature: -

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