Shopping cart

Subtotal: $0.00

40-6553-11

Aries Electronics
40-6553-11 Preview
Aries Electronics
CONN IC DIP SOCKET ZIF 40POS
$27.86
Available to order
Reference Price (USD)
7+
$17.89571
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram

Specifications

  • Product Status: Active
  • Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 40 (2 x 20)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Nickel Boron
  • Contact Finish Thickness - Mating: 50.0µin (1.27µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Nickel Boron
  • Contact Finish Thickness - Post: 50.0µin (1.27µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
  • Operating Temperature: -

Related Products

Mill-Max Manufacturing Corp.

510-91-223-18-095002

Mill-Max Manufacturing Corp.

116-41-320-41-003000

Aries Electronics

64-PLS16016-12

Mill-Max Manufacturing Corp.

510-93-155-18-121001

Aries Electronics

12-0501-21

Aries Electronics

18-1508-31

Aries Electronics

17-0501-21

Mill-Max Manufacturing Corp.

115-91-328-41-001000

Top