514-83-360M19-001148
Preci-Dip
Preci-Dip
CONN SOCKET BGA 360POS GOLD
$41.14
Available to order
Reference Price (USD)
21+
$88.19857
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
The 514-83-360M19-001148 from Preci-Dip is a high-performance IC socket designed for secure and reliable connections in electronic circuits. These sockets are crafted to accommodate integrated circuits (ICs) and transistors, ensuring easy replacement and testing without damaging the components. With durable construction and precision engineering, Preci-Dip's sockets provide excellent electrical conductivity and long-term stability. Ideal for prototyping and production environments, these sockets are compatible with a wide range of ICs and transistors. Applications include consumer electronics, automotive systems, industrial automation, and telecommunications equipment. Whether you're working on PCB designs or repairing electronic devices, the 514-83-360M19-001148 offers a dependable solution for your interconnect needs.
Specifications
- Product Status: Active
- Type: BGA
- Number of Positions or Pins (Grid): 360 (19 x 19)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 29.5µin (0.75µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: -
- Contact Material - Post: Brass
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
- Operating Temperature: -55°C ~ 125°C
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