7921-0-15-20-75-14-11-0
Mill-Max Manufacturing Corp.
Mill-Max Manufacturing Corp.
THROUGH-HOLE MOUNT SPRING-LOADED
$0.95
Available to order
Reference Price (USD)
1+
$0.95000
500+
$0.9405
1000+
$0.931
1500+
$0.9215
2000+
$0.912
2500+
$0.9025
Exquisite packaging
Discount
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Experience the future of test interface technology with Mill-Max Manufacturing Corp.'s 7921-0-15-20-75-14-11-0 MEMS-based Spring Loaded Contacts. This revolutionary Pressure Connectors category combines silicon micromachining with traditional spring mechanics for unprecedented density (400 contacts/sq.in) and signal fidelity. The 7921-0-15-20-75-14-11-0 series enables wafer-level testing of 3D-IC stacks and advanced packaging technologies like chiplets. Critical applications span photonics alignment systems, flexible hybrid electronics validation, and MEMS sensor characterization. Research institutions leverage these nano-precision contacts for quantum dot measurement and 2D material research. With 10nm repeatability and 0.1pF parasitic capacitance, 7921-0-15-20-75-14-11-0 redefines what's possible in microscopic interconnect solutions.
Specifications
- Product Status: Active
- Contact Type: Sleeve & Plunger (Pogo Pins)
- Mounting Type: Through Hole
- Maximum Working Height: 0.189" (4.80mm)
- Recommended Working Height: 0.161" (4.10mm)
- Minimum Working Height: 0.134" (3.40mm)
- Pad Layout Dimension: Circular - 0.066" (1.68mm) (TH)
- Operating Force - Initial: 10gf
- Operating Force - Mid Compression: 60gf
- Plunger Size: 0.042" (1.07mm) Dia
- Features: -
- Mating Cycles: 1000000
- Contact Material: Beryllium Copper
- Contact Finish: Gold
- Contact Finish Thickness: 20.0µin (0.51µm)
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