A-CSL-S-020-B1
Assmann WSW Components

Assmann WSW Components
CONN PIN SPRING LOAD 2.540MM AU
$2.31
Available to order
Reference Price (USD)
1+
$2.31000
500+
$2.2869
1000+
$2.2638
1500+
$2.2407
2000+
$2.2176
2500+
$2.1945
Exquisite packaging
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Experience the future of test interface technology with Assmann WSW Components's A-CSL-S-020-B1 MEMS-based Spring Loaded Contacts. This revolutionary Pressure Connectors category combines silicon micromachining with traditional spring mechanics for unprecedented density (400 contacts/sq.in) and signal fidelity. The A-CSL-S-020-B1 series enables wafer-level testing of 3D-IC stacks and advanced packaging technologies like chiplets. Critical applications span photonics alignment systems, flexible hybrid electronics validation, and MEMS sensor characterization. Research institutions leverage these nano-precision contacts for quantum dot measurement and 2D material research. With 10nm repeatability and 0.1pF parasitic capacitance, A-CSL-S-020-B1 redefines what's possible in microscopic interconnect solutions.
Specifications
- Product Status: Active
- Contact Type: Sleeve & Plunger (Pogo Pins)
- Mounting Type: Surface Mount
- Maximum Working Height: 0.100" (2.54mm)
- Recommended Working Height: 0.088" (2.24mm)
- Minimum Working Height: 0.076" (1.93mm)
- Pad Layout Dimension: Circular - 0.072" (1.83mm)
- Operating Force - Initial: 70gf
- Operating Force - Mid Compression: -
- Plunger Size: 0.042" (1.07mm) Dia
- Features: -
- Mating Cycles: 1000000
- Contact Material: Brass
- Contact Finish: Gold
- Contact Finish Thickness: 20.0µin (0.51µm)