DILB24P-224TLF
Amphenol ICC (FCI)

Amphenol ICC (FCI)
CONN IC DIP SOCKET 24POS TINLEAD
$0.86
Available to order
Reference Price (USD)
12,000+
$0.16241
Exquisite packaging
Discount
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The DILB24P-224TLF by Amphenol ICC (FCI) is a premium IC and transistor socket designed for optimal performance and ease of use. Featuring a secure locking mechanism, it ensures stable connections and protects sensitive components. This socket is ideal for applications requiring frequent component changes, such as testing and prototyping. Widely used in automotive, industrial, and consumer electronics, the DILB24P-224TLF delivers consistent results. Amphenol ICC (FCI)'s expertise in interconnects guarantees a product that meets the highest standards. Choose the DILB24P-224TLF for reliable and efficient connections in your electronic projects.
Specifications
- Product Status: Active
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 24 (2 x 12)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin-Lead
- Contact Finish Thickness - Mating: 100.0µin (2.54µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: 100.0µin (2.54µm)
- Contact Material - Post: Copper Alloy
- Housing Material: Polyamide (PA), Nylon
- Operating Temperature: -55°C ~ 125°C