DIP050-628-157BLF
Amphenol ICC (FCI)
Amphenol ICC (FCI)
CONN IC DIP SOCKET 28POS TIN
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The DIP050-628-157BLF by Amphenol ICC (FCI) is a high-performance socket tailored for ICs and transistors, providing secure and stable connections. Its precision-engineered design ensures minimal contact resistance and optimal signal transmission. Suitable for both through-hole and surface-mount applications, this socket is a favorite among electronics professionals. Applications range from home appliances to advanced robotics and IoT devices. With Amphenol ICC (FCI)'s reputation for quality, the DIP050-628-157BLF is a dependable choice for any project requiring reliable interconnects. Invest in this socket for enhanced performance and longevity in your electronic assemblies.
Specifications
- Product Status: Obsolete
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 28 (2 x 14)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 100.0µin (2.54µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
- Operating Temperature: -
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