DIP306-001BLF
Amphenol ICC (FCI)
Amphenol ICC (FCI)
CONN IC DIP SOCKET 6POS GOLD
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Enhance your electronic designs with the DIP306-001BLF IC and transistor socket from Amphenol ICC (FCI). This high-quality socket provides secure and reliable connections for a variety of components. Its precision design ensures excellent electrical performance and long-term durability. The DIP306-001BLF is suitable for applications in renewable energy systems, automotive electronics, and industrial automation. With Amphenol ICC (FCI)'s commitment to innovation, this socket is a trusted solution for engineers worldwide. Whether for prototyping or production, the DIP306-001BLF offers the reliability and performance you need.
Specifications
- Product Status: Obsolete
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 6 (2 x 3)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
- Operating Temperature: -
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