DIP316-014BLF
Amphenol ICC (FCI)
Amphenol ICC (FCI)
CONN IC DIP SOCKET 16POS TIN
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Trust the DIP316-014BLF IC and transistor socket from Amphenol ICC (FCI) for all your interconnect needs. This high-performance socket ensures secure and stable connections, ideal for a wide range of applications. Its precision engineering guarantees minimal signal loss and maximum reliability. Commonly used in medical devices, telecommunications, and industrial equipment, the DIP316-014BLF is a testament to Amphenol ICC (FCI)'s expertise. Whether you're designing new electronics or maintaining existing systems, this socket provides the quality and performance you demand. Choose the DIP316-014BLF for excellence in interconnects.
Specifications
- Product Status: Obsolete
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 16 (2 x 8)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 100.0µin (2.54µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
- Operating Temperature: -
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