DIP318-011BLF
Amphenol ICC (FCI)
Amphenol ICC (FCI)
CONN IC DIP SOCKET 18POS GOLD
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The DIP318-011BLF by Amphenol ICC (FCI) is a premium IC and transistor socket designed for optimal performance and ease of use. Featuring a secure locking mechanism, it ensures stable connections and protects sensitive components. This socket is ideal for applications requiring frequent component changes, such as testing and prototyping. Widely used in automotive, industrial, and consumer electronics, the DIP318-011BLF delivers consistent results. Amphenol ICC (FCI)'s expertise in interconnects guarantees a product that meets the highest standards. Choose the DIP318-011BLF for reliable and efficient connections in your electronic projects.
Specifications
- Product Status: Obsolete
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 18 (2 x 9)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
- Operating Temperature: -
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