LPC1830FET100,551

NXP USA Inc.

Manufacturer

NXP USA Inc.

Description:

IC MCU 32BIT ROMLESS 100TFBGA

Datasheet:

LPC1830FET100,551 Datasheet

$14.49

Available to order

Reference Price (USD)

$8.25000

10+

$7.45000

25+

$7.10320

260+

$5.89050

520+

$5.37075

1,040+

$4.67775

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

Upgrade your designs with NXP USA Inc.'s LPC1830FET100,551, a standout in our Embedded - Microcontrollers lineup within the Integrated Circuits (ICs) category. These microcontrollers combine {feature 1} and {feature 2} in compact packages ideal for space-constrained applications. The LPC1830FET100,551 shines in automotive telematics, building automation (HVAC control, access systems), and edge computing applications. With {specific peripheral} interfaces and {security feature} security protocols, it's perfect for connected devices requiring robust data protection. Our customers successfully implement these ICs in {example application 1} and {example application 2}, achieving {benefit 1} and {benefit 2}. The LPC1830FET100,551's {unique selling point} makes it superior to comparable microcontrollers in its class.

Specifications

Product Status: Active
Core Processor: ARM® Cortex®-M3
Core Size: 32-Bit Single-Core
Speed: 180MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Number of I/O: 49
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 200K x 8
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Data Converters: A/D 8x10b; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Supplier Device Package: 100-TFBGA (9x9)