LPC18S30FET256551

NXP USA Inc.

Manufacturer

NXP USA Inc.

Description:

IC MCU 32BIT ROMLESS 256LBGA

Datasheet:

LPC18S30FET256551 Datasheet

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The NXP USA Inc. LPC18S30FET256551 represents the pinnacle of Embedded - Microcontrollers technology in our Integrated Circuits (ICs) inventory. Engineered for {target market} applications, this microcontroller series features {core technology} with {performance specification} performance. It's revolutionizing fields like home automation (smart appliances, security systems), precision agriculture (greenhouse control, hydroponics), and wearable technology (fitness trackers, health monitors). The LPC18S30FET256551 stands out with its {unique architecture aspect} architecture and {specialized peripheral} support, enabling {specific functionality}. With {development kit} available and {ecosystem partner} compatibility, transitioning to this advanced microcontroller is seamless. OEMs consistently report {benefit 1} and {benefit 2} when upgrading to the LPC18S30FET256551 for their {typical use case} requirements.

Specifications

Product Status: Active
Core Processor: ARM® Cortex®-M3
Core Size: 32-Bit Single-Core
Speed: 180MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O: 164
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 200K x 8
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Data Converters: A/D 8x10b; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Supplier Device Package: 256-LBGA (17x17)