LPC18S30FET256E

NXP USA Inc.

Manufacturer

NXP USA Inc.

Description:

IC MCU 32BIT ROMLESS 256LBGA

Datasheet:

LPC18S30FET256E Datasheet

$11.99

Available to order

Reference Price (USD)

$10.75000

10+

$9.70700

90+

$9.25578

180+

$8.03672

540+

$6.99826

1,080+

$6.09525

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

The NXP USA Inc. LPC18S30FET256E sets new standards in the Embedded - Microcontrollers segment of Integrated Circuits (ICs). Combining {technology 1} with {technology 2}, this microcontroller delivers unparalleled {performance aspect} for mission-critical applications. It's widely adopted in automotive ADAS systems, industrial robotics (articulated arms, CNC controllers), and smart grid infrastructure. The LPC18S30FET256E features {memory type} with {size} capacity and {connectivity option} for flexible system integration. Developers appreciate its {toolchain support} and {debugging feature} for reduced time-to-market. With {reliability metric} MTBF and {safety certification} compliance, this microcontroller ensures dependable operation in {challenging condition} conditions while providing {key advantage} over competing solutions.

Specifications

Product Status: Active
Core Processor: ARM® Cortex®-M3
Core Size: 32-Bit Single-Core
Speed: 180MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O: 164
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 200K x 8
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Data Converters: A/D 8x10b; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Supplier Device Package: 256-LBGA (17x17)