LPC18S50FET180E

NXP USA Inc.

Manufacturer

NXP USA Inc.

Description:

IC MCU 32BIT ROMLESS 180TFBGA

Datasheet:

LPC18S50FET180E Datasheet

$11.02

Available to order

Reference Price (USD)

$9.87000

10+

$8.91800

25+

$8.50360

189+

$7.38344

567+

$6.42940

1,134+

$5.59980

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

The LPC18S50FET180E from NXP USA Inc. redefines expectations for Embedded - Microcontrollers in the Integrated Circuits (ICs) market. Featuring {core technology} technology with {performance metric}, these microcontrollers handle complex algorithms while maintaining ultra-low power consumption. Ideal for energy harvesting applications, wireless sensor networks, and industrial IoT gateways, the LPC18S50FET180E offers {communication protocol} support and {development tool} compatibility. Engineers choose this series for {application area 1} and {application area 2} due to its {advantage 1} and {advantage 2}. With {temperature range} operating range and {longevity promise} product lifecycle, it's built for reliability in harsh environments and long-term deployments.

Specifications

Product Status: Active
Core Processor: ARM® Cortex®-M3
Core Size: 32-Bit Single-Core
Speed: 180MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number of I/O: 118
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 200K x 8
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Data Converters: A/D 8x10b; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Supplier Device Package: 180-TFBGA (12x12)