P70-2100045R
Harwin Inc.
Harwin Inc.
CONTACT SPRING LOADED T/H GOLD
$1.01
Available to order
Reference Price (USD)
600+
$0.53640
1,200+
$0.47680
1,800+
$0.44700
3,000+
$0.43210
6,000+
$0.41720
15,000+
$0.38740
Exquisite packaging
Discount
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Experience the future of test interface technology with Harwin Inc.'s P70-2100045R MEMS-based Spring Loaded Contacts. This revolutionary Pressure Connectors category combines silicon micromachining with traditional spring mechanics for unprecedented density (400 contacts/sq.in) and signal fidelity. The P70-2100045R series enables wafer-level testing of 3D-IC stacks and advanced packaging technologies like chiplets. Critical applications span photonics alignment systems, flexible hybrid electronics validation, and MEMS sensor characterization. Research institutions leverage these nano-precision contacts for quantum dot measurement and 2D material research. With 10nm repeatability and 0.1pF parasitic capacitance, P70-2100045R redefines what's possible in microscopic interconnect solutions.
Specifications
- Product Status: Active
- Contact Type: Sleeve & Plunger (Pogo Pins)
- Mounting Type: Through Hole
- Maximum Working Height: 0.185" (4.70mm)
- Recommended Working Height: 0.177" (4.50mm)
- Minimum Working Height: 0.165" (4.20mm)
- Pad Layout Dimension: Circular - 0.104" (2.64mm) (TH)
- Operating Force - Initial: -
- Operating Force - Mid Compression: 69.34gf
- Plunger Size: 0.035" (0.90mm) Dia
- Features: -
- Mating Cycles: 10000
- Contact Material: Brass
- Contact Finish: Gold
- Contact Finish Thickness: 16.0µin (0.41µm)
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