R8A77610DA01BGV#U9
Renesas Electronics America Inc
Renesas Electronics America Inc
IC MCU
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Meet the R8A77610DA01BGV#U9 Renesas Electronics America Inc's ultra-compact SoC designed for space-constrained embedded applications. This IC packs processing, wireless connectivity (Wi-Fi/Bluetooth), and sensor interfaces into a single chip, ideal for wearables and asset trackers. Its ultra-low-power modes extend battery life in portable devices, while the rich peripheral set supports rapid prototyping. Deploy the R8A77610DA01BGV#U9 in health monitors, beacons, or environmental sensors for a competitive edge. Renesas Electronics America Inc combines innovation and practicality in this game-changing SoC.
Specifications
- Product Status: Last Time Buy
- Architecture: MPU
- Core Processor: SH-4A
- Flash Size: -
- RAM Size: 16KB
- Peripherals: DDR
- Connectivity: CANbus, I²C, USB
- Speed: 400MHz
- Primary Attributes: -
- Operating Temperature: -
- Package / Case: 449-FBGA
- Supplier Device Package: 449-FBGA (21x21)
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