S1C17F57D00E200
Epson Electronics America Inc-Semiconductor Div
Epson Electronics America Inc-Semiconductor Div
IC MCU 16BIT 32KB FLASH DIE
$0.00
Available to order
Reference Price (USD)
500+
$3.55240
Exquisite packaging
Discount
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The Epson Electronics America Inc-Semiconductor Div S1C17F57D00E200 represents the pinnacle of Embedded - Microcontrollers technology in our Integrated Circuits (ICs) inventory. Engineered for {target market} applications, this microcontroller series features {core technology} with {performance specification} performance. It's revolutionizing fields like home automation (smart appliances, security systems), precision agriculture (greenhouse control, hydroponics), and wearable technology (fitness trackers, health monitors). The S1C17F57D00E200 stands out with its {unique architecture aspect} architecture and {specialized peripheral} support, enabling {specific functionality}. With {development kit} available and {ecosystem partner} compatibility, transitioning to this advanced microcontroller is seamless. OEMs consistently report {benefit 1} and {benefit 2} when upgrading to the S1C17F57D00E200 for their {typical use case} requirements.
Specifications
- Product Status: Obsolete
- Core Processor: S1C17
- Core Size: 16-Bit
- Speed: 4.2MHz
- Connectivity: I²C, IrDA, SPI, UART/USART
- Peripherals: PWM, WDT
- Number of I/O: 29
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: Die
- Supplier Device Package: -
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