SIP050-1X18-157BLF
Amphenol ICC (FCI)
Amphenol ICC (FCI)
CONN SOCKET SIP 18POS TIN
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Engineered for excellence, the SIP050-1X18-157BLF IC and transistor socket from Amphenol ICC (FCI) offers unmatched reliability and performance. These sockets are designed to simplify the installation and replacement of ICs and transistors, reducing the risk of damage. Perfect for high-reliability applications, the SIP050-1X18-157BLF is used in military, medical, and telecommunications equipment. Its robust construction ensures durability even in extreme conditions. Trust Amphenol ICC (FCI) to deliver high-quality interconnects that meet the demands of modern electronics. The SIP050-1X18-157BLF is the ideal choice for professionals seeking precision and durability in their components.
Specifications
- Product Status: Obsolete
- Type: SIP
- Number of Positions or Pins (Grid): 18 (1 x 18)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200.0µin (5.08µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
- Operating Temperature: -
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