SIP1X27-014BLF
Amphenol ICC (FCI)
Amphenol ICC (FCI)
CONN SOCKET SIP 27POS TIN
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The SIP1X27-014BLF by Amphenol ICC (FCI) is a top-quality socket designed for ICs and transistors, offering exceptional reliability and ease of use. These sockets feature a robust design that ensures stable connections and protects components during insertion and removal. Ideal for high-frequency and high-speed applications, the SIP1X27-014BLF delivers superior signal integrity. Common uses include computer motherboards, medical devices, and aerospace systems. With Amphenol ICC (FCI)'s commitment to excellence, this socket is a trusted choice for engineers and technicians worldwide. Whether for prototyping or mass production, the SIP1X27-014BLF provides a seamless solution for your interconnect requirements.
Specifications
- Product Status: Obsolete
- Type: SIP
- Number of Positions or Pins (Grid): 27 (1 x 27)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 150.0µin (3.81µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature: -
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