UPD70F3525GJA9-GAE-X2-G
Renesas Electronics America Inc
Renesas Electronics America Inc
UPD70F3525GJA9-GAE-X2-G
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Upgrade your designs with Renesas Electronics America Inc's UPD70F3525GJA9-GAE-X2-G, a standout in our Embedded - Microcontrollers lineup within the Integrated Circuits (ICs) category. These microcontrollers combine {feature 1} and {feature 2} in compact packages ideal for space-constrained applications. The UPD70F3525GJA9-GAE-X2-G shines in automotive telematics, building automation (HVAC control, access systems), and edge computing applications. With {specific peripheral} interfaces and {security feature} security protocols, it's perfect for connected devices requiring robust data protection. Our customers successfully implement these ICs in {example application 1} and {example application 2}, achieving {benefit 1} and {benefit 2}. The UPD70F3525GJA9-GAE-X2-G's {unique selling point} makes it superior to comparable microcontrollers in its class.
Specifications
- Product Status: Last Time Buy
- Core Processor: V850E2M
- Core Size: 32-Bit
- Speed: 120MHz
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, LINbus, SCI, SPI, SSI, UART/USART, USB
- Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
- Number of I/O: 105
- Program Memory Size: 2MB (2M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 32K x 8
- RAM Size: 192K x 8
- Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
- Data Converters: A/D 16x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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