UPD70F3558M2GM-GBK-X3-AX
Renesas Electronics America Inc
Renesas Electronics America Inc
UPD70F3558M2GM-GBK-X3-AX
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Introducing the UPD70F3558M2GM-GBK-X3-AX from Renesas Electronics America Inc's distinguished line of Embedded - Microcontrollers in our Integrated Circuits (ICs) catalog. This high-efficiency microcontroller boasts {architecture} architecture with {clock speed} maximum frequency, optimized for {target application type}. The UPD70F3558M2GM-GBK-X3-AX excels in consumer electronics (voice recognition devices, gaming peripherals), industrial control (PID controllers, pneumatic systems), and transportation (fleet tracking, toll systems). Its {feature set} includes {notable feature 1}, {notable feature 2}, and {notable feature 3} for comprehensive solution coverage. Compared to previous generations, the UPD70F3558M2GM-GBK-X3-AX offers {improvement percentage}% better {metric} while maintaining backward compatibility with {legacy standard}. A perfect fusion of innovation and practicality for modern embedded designs.
Specifications
- Product Status: Last Time Buy
- Core Processor: V850E2M
- Core Size: 32-Bit
- Speed: 80MHz
- Connectivity: CANbus, CSI, I²C, LINbus, UART/USART
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 137
- Program Memory Size: 2MB (2M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 144K x 8
- Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
- Data Converters: A/D 40x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 176-LQFP Exposed Pad
- Supplier Device Package: 176-HLQFP (24x24)
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