XCVC1802-2MLIVSVD1760

AMD Xilinx

Manufacturer

AMD Xilinx

Description:

IC VERSAL AICORE FPGA 1760BGA

Datasheet:

XCVC1802-2MLIVSVD1760 Datasheet

$38,052.51

Available to order

Reference Price (USD)

$38052.51000

500+

$37671.9849

1000+

$37291.4598

1500+

$36910.9347

2000+

$36530.4096

2500+

$36149.8845

Exquisite packaging

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Discover the XCVC1802-2MLIVSVD1760, a cutting-edge System on Chip (SoC) by AMD Xilinx, engineered for embedded systems requiring high computational power and energy efficiency. This SoC combines CPU, GPU, and DSP cores with integrated memory, making it perfect for AI-driven applications, robotics, and edge computing. With support for real-time operating systems (RTOS) and robust connectivity options, the XCVC1802-2MLIVSVD1760 is a top choice for developers. Whether used in medical devices, drones, or industrial controllers, AMD Xilinx's XCVC1802-2MLIVSVD1760 ensures optimal performance and scalability for your next-gen projects.

Specifications

Product Status: Active
Architecture: MPU, FPGA
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.4GHz
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BFBGA, FCBGA
Supplier Device Package: 1760-FCBGA (40x40)