XP3A-4654-0730D-T/S
Omron Electronics Inc-EMC Div
Omron Electronics Inc-EMC Div
CONTACT SPRING LOADED T/H GOLD
$10.84
Available to order
Reference Price (USD)
1+
$10.84000
500+
$10.7316
1000+
$10.6232
1500+
$10.5148
2000+
$10.4064
2500+
$10.298
Exquisite packaging
Discount
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Experience the future of test interface technology with Omron Electronics Inc-EMC Div's XP3A-4654-0730D-T/S MEMS-based Spring Loaded Contacts. This revolutionary Pressure Connectors category combines silicon micromachining with traditional spring mechanics for unprecedented density (400 contacts/sq.in) and signal fidelity. The XP3A-4654-0730D-T/S series enables wafer-level testing of 3D-IC stacks and advanced packaging technologies like chiplets. Critical applications span photonics alignment systems, flexible hybrid electronics validation, and MEMS sensor characterization. Research institutions leverage these nano-precision contacts for quantum dot measurement and 2D material research. With 10nm repeatability and 0.1pF parasitic capacitance, XP3A-4654-0730D-T/S redefines what's possible in microscopic interconnect solutions.
Specifications
- Product Status: Obsolete
- Contact Type: Probe Pin
- Mounting Type: Through Hole
- Maximum Working Height: 0.116" (2.95mm)
- Recommended Working Height: 0.104" (2.65mm)
- Minimum Working Height: -
- Pad Layout Dimension: -
- Operating Force - Initial: 15gf
- Operating Force - Mid Compression: -
- Plunger Size: 0.003" ~ 0.018" (0.07mm ~ 0.046mm)
- Features: -
- Mating Cycles: -
- Contact Material: Nickel Alloy
- Contact Finish: Gold
- Contact Finish Thickness: 40.0µin (1.02µm)
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