XP3B-3029-5050-1-D/T
Omron Electronics Inc-EMC Div
Omron Electronics Inc-EMC Div
CONTACT SPRING LOADED T/H GOLD
$2.68
Available to order
Reference Price (USD)
1+
$3.94000
10+
$3.77900
25+
$3.46440
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Experience the future of test interface technology with Omron Electronics Inc-EMC Div's XP3B-3029-5050-1-D/T MEMS-based Spring Loaded Contacts. This revolutionary Pressure Connectors category combines silicon micromachining with traditional spring mechanics for unprecedented density (400 contacts/sq.in) and signal fidelity. The XP3B-3029-5050-1-D/T series enables wafer-level testing of 3D-IC stacks and advanced packaging technologies like chiplets. Critical applications span photonics alignment systems, flexible hybrid electronics validation, and MEMS sensor characterization. Research institutions leverage these nano-precision contacts for quantum dot measurement and 2D material research. With 10nm repeatability and 0.1pF parasitic capacitance, XP3B-3029-5050-1-D/T redefines what's possible in microscopic interconnect solutions.
Specifications
- Product Status: Obsolete
- Contact Type: Probe Pin
- Mounting Type: Through Hole
- Maximum Working Height: 0.112" (2.85mm)
- Recommended Working Height: 0.096" (2.45mm)
- Minimum Working Height: 0.093" (2.35mm)
- Pad Layout Dimension: -
- Operating Force - Initial: 25gf
- Operating Force - Mid Compression: -
- Plunger Size: 0.002" ~ 0.008" (0.06mm ~ 0.20mm)
- Features: -
- Mating Cycles: 1000000
- Contact Material: Nickel Alloy
- Contact Finish: Gold
- Contact Finish Thickness: -
Related Products
Preci-Dip
90029-AS
Omron Electronics Inc-EMC Div
XP3A-5866-0725D-R/S
Mill-Max Manufacturing Corp.
0929-7-15-20-75-14-11-0
Mill-Max Manufacturing Corp.
0985-2-15-20-71-14-11-0
Mill-Max Manufacturing Corp.
806-22-001-30-010191
Adam Tech
PH-MVF-5380
Mill-Max Manufacturing Corp.
1625-0-57-15-00-00-03-0
Harwin Inc.
S70-220101045R
Omron Electronics Inc-EMC Div
XP3B-3829-5050-1-T/T
Mill-Max Manufacturing Corp.