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XR2A-0811-N

Omron Electronics Inc-EMC Div
XR2A-0811-N Preview
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 8POS GOLD
$0.96
Available to order
Reference Price (USD)
60+
$0.76367
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram

Specifications

  • Product Status: Active
  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 8 (2 x 4)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10.0µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10.0µin (0.25µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
  • Operating Temperature: -55°C ~ 125°C

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