1656-2-57-15-00-00-03-0
Mill-Max Manufacturing Corp.
Mill-Max Manufacturing Corp.
.156" DIAMETER TARGET DISC
$0.77
Available to order
Reference Price (USD)
1+
$0.77000
500+
$0.7623
1000+
$0.7546
1500+
$0.7469
2000+
$0.7392
2500+
$0.7315
Exquisite packaging
Discount
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Experience the future of test interface technology with Mill-Max Manufacturing Corp.'s 1656-2-57-15-00-00-03-0 MEMS-based Spring Loaded Contacts. This revolutionary Pressure Connectors category combines silicon micromachining with traditional spring mechanics for unprecedented density (400 contacts/sq.in) and signal fidelity. The 1656-2-57-15-00-00-03-0 series enables wafer-level testing of 3D-IC stacks and advanced packaging technologies like chiplets. Critical applications span photonics alignment systems, flexible hybrid electronics validation, and MEMS sensor characterization. Research institutions leverage these nano-precision contacts for quantum dot measurement and 2D material research. With 10nm repeatability and 0.1pF parasitic capacitance, 1656-2-57-15-00-00-03-0 redefines what's possible in microscopic interconnect solutions.
Specifications
- Product Status: Active
- Contact Type: Contact Pad
- Mounting Type: Surface Mount
- Maximum Working Height: -
- Recommended Working Height: -
- Minimum Working Height: -
- Pad Layout Dimension: Circular - 0.156" (3.96mm) Dia, 0.045" (1.14mm) H
- Operating Force - Initial: -
- Operating Force - Mid Compression: -
- Plunger Size: -
- Features: -
- Mating Cycles: -
- Contact Material: Brass Alloy
- Contact Finish: Gold
- Contact Finish Thickness: 10.0µin (0.25µm)
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