550-10-357M19-001152
Preci-Dip
Preci-Dip
BGA SOLDER TAIL
$41.14
Available to order
Reference Price (USD)
19+
$101.57053
Exquisite packaging
Discount
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The 550-10-357M19-001152 by Preci-Dip is a top-quality socket designed for ICs and transistors, offering exceptional reliability and ease of use. These sockets feature a robust design that ensures stable connections and protects components during insertion and removal. Ideal for high-frequency and high-speed applications, the 550-10-357M19-001152 delivers superior signal integrity. Common uses include computer motherboards, medical devices, and aerospace systems. With Preci-Dip's commitment to excellence, this socket is a trusted choice for engineers and technicians worldwide. Whether for prototyping or mass production, the 550-10-357M19-001152 provides a seamless solution for your interconnect requirements.
Specifications
- Product Status: Active
- Type: BGA
- Number of Positions or Pins (Grid): 357 (19 x 19)
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Contact Material - Mating: Brass
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10.0µin (0.25µm)
- Contact Material - Post: Brass
- Housing Material: FR4 Epoxy Glass
- Operating Temperature: -55°C ~ 125°C