XP3A-5866-0770D-T/S
Omron Electronics Inc-EMC Div
Omron Electronics Inc-EMC Div
CONTACT SPRING LOADED T/H GOLD
$10.84
Available to order
Reference Price (USD)
1+
$10.84000
500+
$10.7316
1000+
$10.6232
1500+
$10.5148
2000+
$10.4064
2500+
$10.298
Exquisite packaging
Discount
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The XP3A-5866-0770D-T/S from Omron Electronics Inc-EMC Div redefines reliability in Spring Loaded Contacts for high-density interconnect challenges. Featuring patented anti-sticking coatings and dual-spring overload protection, these Pogo Pins maintain stable contact resistance across 50,000 mating cycles. Our specialized Contacts collection serves medical imaging equipment (MRI probe connections), semiconductor wafer testing, and military-grade communications gear. Implementation examples include: automated drug discovery instruments, LiDAR sensor calibration jigs, and missile guidance system test points. With current ratings to 10A (per pin) and customizable lengths from 2mm-15mm, XP3A-5866-0770D-T/S solves complex connectivity challenges in space-constrained, harsh environment applications.
Specifications
- Product Status: Obsolete
- Contact Type: Probe Pin
- Mounting Type: Through Hole
- Maximum Working Height: 0.281" (7.15mm)
- Recommended Working Height: 0.262" (6.65mm)
- Minimum Working Height: -
- Pad Layout Dimension: -
- Operating Force - Initial: 15gf
- Operating Force - Mid Compression: -
- Plunger Size: 0.003" ~ 0.023" (0.07mm ~ 0.58mm)
- Features: -
- Mating Cycles: -
- Contact Material: Nickel Alloy
- Contact Finish: Gold
- Contact Finish Thickness: 40.0µin (1.02µm)
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