0850-0-15-20-83-14-11-0
Mill-Max Manufacturing Corp.

Mill-Max Manufacturing Corp.
CONTACT SPRING LOADED T/H GOLD
$1.46
Available to order
Reference Price (USD)
1+
$1.39000
10+
$1.22200
25+
$1.15040
50+
$1.10240
100+
$1.05450
250+
$0.95868
500+
$0.86280
1,000+
$0.76693
2,500+
$0.69503
Exquisite packaging
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Experience the future of test interface technology with Mill-Max Manufacturing Corp.'s 0850-0-15-20-83-14-11-0 MEMS-based Spring Loaded Contacts. This revolutionary Pressure Connectors category combines silicon micromachining with traditional spring mechanics for unprecedented density (400 contacts/sq.in) and signal fidelity. The 0850-0-15-20-83-14-11-0 series enables wafer-level testing of 3D-IC stacks and advanced packaging technologies like chiplets. Critical applications span photonics alignment systems, flexible hybrid electronics validation, and MEMS sensor characterization. Research institutions leverage these nano-precision contacts for quantum dot measurement and 2D material research. With 10nm repeatability and 0.1pF parasitic capacitance, 0850-0-15-20-83-14-11-0 redefines what's possible in microscopic interconnect solutions.
Specifications
- Product Status: Active
- Contact Type: Sleeve & Plunger (Pogo Pins)
- Mounting Type: Through Hole
- Maximum Working Height: 0.220" (5.58mm)
- Recommended Working Height: 0.175" (4.44mm)
- Minimum Working Height: 0.130" (3.29mm)
- Pad Layout Dimension: Circular - 0.153" (3.89mm) (TH)
- Operating Force - Initial: 25gf
- Operating Force - Mid Compression: 120gf
- Plunger Size: 0.050" (1.27mm) Dia
- Features: -
- Mating Cycles: 1000000
- Contact Material: Copper Alloy
- Contact Finish: Gold
- Contact Finish Thickness: 20.0µin (0.51µm)