0906-2
Preci-Dip
Preci-Dip
CONTACT SPRING LOADED T/H GOLD W
$0.79
Available to order
Reference Price (USD)
1+
$0.79000
500+
$0.7821
1000+
$0.7742
1500+
$0.7663
2000+
$0.7584
2500+
$0.7505
Exquisite packaging
Discount
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Experience the future of test interface technology with Preci-Dip's 0906-2 MEMS-based Spring Loaded Contacts. This revolutionary Pressure Connectors category combines silicon micromachining with traditional spring mechanics for unprecedented density (400 contacts/sq.in) and signal fidelity. The 0906-2 series enables wafer-level testing of 3D-IC stacks and advanced packaging technologies like chiplets. Critical applications span photonics alignment systems, flexible hybrid electronics validation, and MEMS sensor characterization. Research institutions leverage these nano-precision contacts for quantum dot measurement and 2D material research. With 10nm repeatability and 0.1pF parasitic capacitance, 0906-2 redefines what's possible in microscopic interconnect solutions.
Specifications
- Product Status: Active
- Contact Type: Sleeve & Plunger (Pogo Pins)
- Mounting Type: Through Hole
- Maximum Working Height: 0.197" (5.00mm)
- Recommended Working Height: 0.145" (3.68mm)
- Minimum Working Height: 0.142" (3.60mm)
- Pad Layout Dimension: Circular - 0.072" (1.83mm)
- Operating Force - Initial: 25.49gf
- Operating Force - Mid Compression: 91.77gf
- Plunger Size: 0.042" (1.07mm) Dia
- Features: -
- Mating Cycles: 100000
- Contact Material: Brass
- Contact Finish: Gold
- Contact Finish Thickness: 20.0µin (0.51µm)
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