FZ1500R33HE3B60BPSA1
Infineon Technologies
Infineon Technologies
IHV IHM T XHP 3 3-6 5K AG-IHVB19
$3,148.08
Available to order
Reference Price (USD)
1+
$3148.08000
500+
$3116.5992
1000+
$3085.1184
1500+
$3053.6376
2000+
$3022.1568
2500+
$2990.676
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
The FZ1500R33HE3B60BPSA1 from Infineon Technologies exemplifies excellence in Transistors - IGBTs - Modules technology. This discrete semiconductor solution features a unique direct liquid cooling design for maximum power density. Technical highlights include: 200% overload capability, ultra-thin wafer technology, and short-circuit protection. The module excels in demanding applications such as electric aircraft propulsion, mining equipment, and high-speed rail systems. A typical deployment would be using the FZ1500R33HE3B60BPSA1 in megawatt-level wind turbine converters. With Infineon Technologies's proven track record, the FZ1500R33HE3B60BPSA1 represents the future of power semiconductor modules.
Specifications
- Product Status: Active
- IGBT Type: Trench Field Stop
- Configuration: Single Switch
- Voltage - Collector Emitter Breakdown (Max): 3300 V
- Current - Collector (Ic) (Max): 1500 A
- Power - Max: 2.4 MW
- Vce(on) (Max) @ Vge, Ic: 3.1V @ 15V, 1.5kA
- Current - Collector Cutoff (Max): 5 mA
- Input Capacitance (Cies) @ Vce: 280 nF @ 25 V
- Input: Standard
- NTC Thermistor: No
- Operating Temperature: -40°C ~ 150°C (TJ)
- Mounting Type: Chassis Mount
- Package / Case: Module
- Supplier Device Package: AG-IHVB190